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Analog Integrated Circuit Device Data
Freescale Semiconductor
5
34652
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
rchived by Freescale Semiconductor, Inc., 2008
Peak Package Reflow Temperature During Reflow
(5), (6)
T
PPRT
 Note 6
癈
Thermal Resistance
(7)
 
,
 
(8)
Junction-to-Ambient, Single-Layer Board
(9)
Junction-to-Ambient, Four-Layer Board
(10)
R
窲A
R
窲MA
103
65
癈/W
Notes
5. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
6. Freescales Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
7. Refer to the section titled Thermal Shutdown on page 16 for more thermal resistance values under various conditions.
8. The VOUT and VIN pins comprise the main heat conduction paths.
9. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
10. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal. There are no thermal vias connecting the package to the two planes in the
board.
Table 2. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
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